Richard A. Gould, Certified Quality Manager, CQA, CQE, CQT

Richard (Dick) A. Gould is an independent consultant and trainer. He provides consulting and training in quality systems, outsourcing, supply chain management, business process improvement, risk management and auditing. Gould has served large and small companies in the defense, medical device, electronics, and computer industries. He has been auditing since 1970.

Gould’s industrial experience includes seven years in supplier quality engineering for radar and ordnance systems and magnetic recording media, four years in quality engineering and regulatory affairs for surgical instruments, sterile disposable medical products, medical devices and implants, and over 25 years in quality engineering, quality management, and supplier quality management for electronic components, computer peripherals, and computer tape and disk drives.

Gould has presented papers on the subjects of quality systems, supplier quality, supply chain optimization, and auditing at numerous conferences.

Richard is an ASQ Fellow and an active member of the Society’s Division Affairs Council. He is past chair and current Vice Chair – Technology of the Customer-Supplier Division of ASQ. He holds Certified Quality Auditor, Certified Quality Engineer, and Certified Quality Manager certificates. He was a contributing author to the CertifiedQuality Manager Handbook, first edition, published by Quality Press in 1999.

Gould has degrees in industrial management and liberal arts from Northeastern University and Vanguard University of Southern California. He has traveled extensively throughout the USA, as well as Japan, Malaysia, Singapore, Korea, the United Kingdom, Ireland, France, Italy, and the Peoples Republic of China.

Quality Engineering/Regulatory Affairs for manufacture of sterile implant medical devices, surgical instruments, and sterile disposable products.

Supplier quality engineering for manufacture of computer tape and disk drives, magnetic recording media (disk and tape) and recording heads (disk and tape), IC manufacture (wafer fabrication, assembly, test), passive component manufacture (ceramic, tantalum capacitors, resistors, crystals, oscillators), manufacture of packaging, printed circuit board fabrication and assembly.